ECSS discipline Q-70 Materials, Mechanical Parts and Processes (February 2022)
The course will cover the practical relevance of Materials, Mechanical Parts and Processes (MMPP) Product Assurance from the Q-70 ECSS discipline; the associated processes, milestones, risks associated with the omission of requirements, and the benefits of an adequate and timely implementation of requirements in the project and mission context.
The course will provide the attendees a basic awareness of necessary engineering activities, decision criteria for the selection of materials, mechanical parts and processes, the identification of general risk areas, information resources, and where to find expert support.
The schedule of the course will be:
Day 1 - Wednesday 16th February 2022
10.00 - 12.00
Q-70 discipline (introduction to Q-70C and Q 70-71, ECSS tree overview, MPCB process inc. assembly MPCB, DMPL tool)
12.00 - 13.00 lunch break
13.00-14.00
Materials, Testing and processes Q-70 36C/37C/45C/14C (mechanical testing, stress corrosion, NDI, failure analysis)
14.00-16.00
Materials, Testing and processes Q-70 02C/04/06/3C/9C/13C/16C/17C (thermal, particle/UV, offgassing, TO, coatings)
Day 2 - Thursday 17th February 2022
10.00 - 10.30
REACH, obsolescence and associated requirements
10.30 -12.30
Assembly processes, parts and PCB Q-70 07/08/26/28/30/38 : SMT, soldering, crimping, PCB, conformal coatings
12.30 - 13.30 lunch break
13.30-14.30
Manufacturing, procurement, AIT Q-70 39/40/46 fasteners, brazing, welding
14.30-15.30
Manufacturing, procurement, AIT Q-70 03/16/23/31 coating, bonding, cleanliness, inspection
15.30-16.00
Q&A / wrap-up
The objective of Q-70 Materials, Mechanical Parts and Processes course is to develop a basic understanding and appreciation of PA requirements for Materials, Mechanical Parts and Processes to be used in space projects.
ESA TEC-QEE and TEC-MSP
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This ECSS session will be recorded and will be made available online afterwards.
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